Use Statistical Process Control To Improve Yields and Avoid Waste in The Fabrication Process
Using control charts and capability analysis to measure critical characteristics like wafer thickness, deposition rates (the rate of depositing material on the wafer surface as a thin layer to contain electrical properties), endpoint times (to detect the most accurate time to stop the etch process in order to avoid over or under etch), among others will help ensure that your process and equipment are in control. If you’re already employing SPC methods, using Minitab’s next generation of statistical process control can help you improve your techniques and deliver real-time savings.
Use Design of Experiment to Improve Manufacturing Processes
Because semiconductor manufacturing is comprised of multiple complex processes, even the most experienced and competent engineers may not necessarily know the best settings for the manufacturing equipment. Even if the optimal settings are known, new technologies are constantly being adopted which introduce unknown situations and new problems. Design of Experiments help engineers build a comprehensive model to help understand, very precisely, how the system works. Learn more about DOE in action that helped to improve the degree of uniformity in one manufacturer’s polishing process by reading this blog post or more about DOE in general by watching this webinar.
Use Machine Learning for Post Silicon Validation
Unlike production testing where you’re taking measurements and making pass-fail decisions, in post silicon validation you need to understand in great detail the behavior of the device under all kinds of operating conditions. Using machine learning, you can better understand how the inputs of the device impact the outputs and find hidden relationships and complexities between them. With Minitab’s Predictive Analytics module, you can build a robust predictive model or use tools like our variable importance chart to highlight the most critical inputs that impact performance.
